Product guide
Thermal interface materials (TIM)
Thermal interface materials (TIMs) sit between an electronic component and a heat sink or chassis, filling surface irregularities and reducing contact thermal resistance. Pads accommodate gaps and tolerances; greases and compounds form thin layers; putties conform to uneven geometries; tapes and adhesives combine heat transfer with attachment. I.M Technology also offers insulating fiberglass sheets, heat-spreading materials and EMI shielding solutions. Selection requires assessing thickness, compressibility, electrical insulation and assembly conditions, rather than thermal conductivity alone.
Discuss your thermal interface requirementsProducts and technical requirements
I support engineers and purchasing teams in clarifying the requirement, identifying relevant products and discussing the technical and commercial aspects with the partner. Share your application and an existing datasheet where available: a proposed alternative still requires validation in your design.
Partner and product-line references
The relevant partnership for this family is DSPM TLC. My role and the official company links are described on the partners page.
Brands listed on this website for the relevant product area:
- I.M Technology
Silicone and non-silicone thermal pads, electrically insulating thermally conductive fiberglass sheets, thermal compounds and greases, thermal putty, thermal tapes and thermal adhesives. Heat-spreading and EMI shielding materials, heat-dissipation films and ceramic spreaders complete the range.
Availability, exact specifications and supply conditions are assessed against the requested part number and project.
Documents to prepare
Share the information already available and identify anything still to be defined. Attach documents in the enquiry form; agree sharing arrangements first for confidential files.
- Drawing or dimensions of the contact surfaces and gap to fill.
- Datasheet for any existing material and assembly conditions.
- Insulation requirements, silicone compatibility, shape and quantities.
The form accepts up to 3 files: 2 MB each and 3 MB in total. For larger documents, use the email contact.
Questions before your enquiry
Can I compare an existing material with an alternative?
Send the reference and datasheet for the existing material and identify the requirements that must remain unchanged. Discussion with DSPM about the I.M Technology line does not replace application testing.
Does this enquiry also cover a heat sink?
State whether you need only an interface material or also a heat sink. These are separate families: I.M Technology is handled through DSPM; ALUTHERM is the partner for heat sinks.
Explore the product families
Product guides, selection criteria and information to include in your enquiry.
- RF and microwave components
- Industrial connectors and cable assemblies
- Passive components, ferrites and crystals
- Power supplies and DC/DC converters
- Optoelectronics and fibre-optic components
- LCD, TFT, OLED displays and touch screens
- Heat sinks and aluminium profilesALUTHERM
- Printed circuit boards and PCBA assembly
- Diodes, transistors, MOSFETs and IGBTs
- Relays, switches and optoisolators
- Fuses, TVS diodes, varistors and circuit protection
- Temperature sensors, pressure sensors and encoders
- Integrated circuits, memory and interfaces
- Electromechanical components
- Acoustic products and more
- Custom cable assemblies
- Thermal interface materials (TIM)I.M Technology · DSPM